NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial
Description:
• System:
– ARM Cortex-M0 processor, running at frequencies of up to 50 MHz.
– ARM Cortex-M0 built-in Nested Vectored Interrupt Controller (NVIC).
– Serial Wire Debug.
– System tick timer.
• Memory:
– On-chip flash programming memory for LPC1100, LPC1100L, and LPC1100C
series: 32 kB (LPC1114/LPC11C14), 24 kB (LPC1113), 16 kB
(LPC1112/LPC11C12), or 8 kB (LPC1111), 4kB (LPC1110).
– On-chip flash programming memory for LPC1100XL series: 8 kB (LPC1111), 16 kB
(LPC1112), 24 kB (LPC1113), 32 kB (LPC1114/203/303), 48 kB (LPC1114/323),
56 kB (LPC1114/333), 64 kB (LPC1115).
– 8 kB, 4 kB, 2 kB, or 1 kB SRAM.
– In-System Programming (ISP) and In-Application Programming (IAP) via on-chip
bootloader software.
– LPC1100XL series only: page erase IAP command.
• Digital peripherals:
– Up to 42 General Purpose I/O (GPIO) pins with configurable pull-up/pull-down
resistors. Number of GPIO pins is reduced for smaller packages and
LPC11C22/C24.
– GPIO pins can be used as edge and level sensitive interrupt sources.
– High-current output driver (20 mA) on one pin.
– High-current sink drivers (20 mA) on two I2C-bus pins in Fast-mode Plus.
– Four general purpose timers/counters with a total of four capture inputs and up to
13 match outputs.
– Programmable WatchDog Timer (WDT).
• Analog peripherals:
– 10-bit ADC with input multiplexing among up to 8 pins.
• Serial interfaces:
– UART with fractional baud rate generation, internal FIFO, and RS-485 support.
– Two SPI controllers with SSP features and with FIFO and multi-protocol
capabilities (second SPI on LQFP48 packages only).
– I
2C-bus interface supporting full I2C-bus specification and Fast-mode Plus with a
data rate of 1 Mbit/s with multiple address recognition and monitor mode.
– C_CAN controller (LPC11Cxx only). On-chip CAN and CANopen drivers included.
– On-chip, high-speed CAN transceiver (parts LPC11C22/C24 only).
• Clock generation:
– 12 MHz internal RC oscillator trimmed to 1% accuracy that can optionally be used
as a system clock.
– Crystal oscillator with an operating range of 1 MHz to 25 MHz.UM10398 All information provided in this document is subject to legal disclaimers. © NXP B.V. 2014. All rights reserved.
User manual Rev. 12.3 — 10 June 2014 7 of 547
NXP Semiconductors UM10398
Chapter 1: LPC111x/LPC11Cxx Introductory information
– Programmable watchdog oscillator with a frequency range of 7.8 kHz to 1.8 MHz.
– PLL allows CPU operation up to the maximum CPU rate without the need for a
high-frequency crystal. May be run from the system oscillator or the internal RC
oscillator.
– Clock output function with divider that can reflect the system oscillator clock, IRC
clock, CPU clock, and the Watchdog clock.
• Power control:
– Integrated PMU (Power Management Unit) to minimize power consumption during
Sleep, Deep-sleep, and Deep power-down modes.
– Power profiles residing in boot ROM allowing to optimize performance and
minimize power consumption for any given application through one simple function
call. (On LPC1100L and LPC1100XL parts only).
– Three reduced power modes: Sleep, Deep-sleep, and Deep power-down.
– Processor wake-up from Deep-sleep mode via a dedicated start logic using up to
13 of the functional pins.
– Power-On Reset (POR).
– Brownout detect with up to four separate thresholds for interrupt and forced reset.
• Unique device serial number for identification.
• Single 3.3 V power supply (1.8 V to 3.6 V).
• Available as LQFP48 package, HVQFN33 package.
• LPC1100L series also available as HVQFN24, TSSOP28 package, DIP28 package,
TSSOP20 package, and SO20 package.
• Available as dual-chip module consisting of the LPC1114 single-chip microcontroller
combined with a PCF8576D Universal LCD driver in a 100-pin LQFP package (part
LPC11D14FBD100/302).1
Specification:
| Standard package | 260pcs/tray |
| Category | Integrated Circuits (ICs) |
| Family | Embedded - Microcontrollers |
| Series | LPC1100L |
| Packaging | Tray |
| Core Processor | ARM® Cortex®-M0 |
| Core Size | 32-Bit |
| Speed | 50MHz |
| Connectivity | I²C, SPI, UART/USART |
| Peripherals | Brown-out Detect/Reset, POR, WDT |
| Number of I/O | 28 |
| Program Memory Size | 32KB (32K x 8) |
| Program Memory Type | FLASH |
| EEPROM Size | - |
| RAM Size | 8K x 8 |
| Voltage - Supply (Vcc/Vdd) | 1.8 V ~ 3.6 V |
| Data Converters | A/D 8x10b |
| Oscillator Type | Internal |
| Operating Temperature | -40°C ~ 85°C |
| Package / Case | 32-VQFN Exposed Pad |
| Supplier Device Package | 32-HVQFN (7x7) |
Ordering Information:
| Type number | Package | Description | Version |
| SO20, TSSOP20, TSSOP28, and DIP28 packages | |
| LPC1110FD20 | SO20 | SO20: plastic small outline package; 20 leads; body width 7.5 mm | SOT163-1 |
| LPC1111FDH20/002 | TSSOP20 | TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm | SOT360-1 |
| LPC1112FD20/102 | SO20 | SO20: plastic small outline package; 20 leads; body width 7.5 mm width 4.4 mm | SOT163-1 |
| LPC1112FDH20/102 | TSSOP20 | TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4.4 mm | SOT360-1 |
| LPC1112FDH28/102 | TSSOP28 | TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm | SOT361-1 |
| LPC1114FDH28/102 | TSSOP28 | TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm | SOT361-1 |
| LPC1114FN28/102 | DIP28 | DIP28: plastic dual in-line package; 28 leads (600 mil) | SOT117-1 |
| HVQFN24/33, LQFP48, and TFBGA48 packages | |
| LPC1111FHN33/101 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1111FHN33/102 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1111FHN33/201 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1111FHN33/202 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1111FHN33/103 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1111JHN33/103 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1111FHN33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1111JHN33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1112FHN33/101 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1112FHN33/102 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1112FHN33/201 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1112FHN33/202 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1112FHN24/202 | HVQFN24 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 4 x 4 x 0.85 mm | SOT616-3 |
| LPC1112FHI33/102 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm | n/a |
| LPC1112FHI33/202 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm | n/a |
| LPC1112FHI33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm | n/a |
| LPC1112JHI33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm | n/a |
| LPC1112FHN33/103 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1112JHN33/103 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1112JHN33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1112FHN33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1113FHN33/201 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1113FHN33/202 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1113FHN33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1113JHN33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1113FHN33/301 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1113FHN33/302 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1113FHN33/303 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1113JHN33/303 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1114FHN33/201 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1114FHN33/202 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1114FHN33/301 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1114FHN33/302 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1114FHI33/302 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1114FHI33/303 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm | n/a |
| LPC1114JHI33/303 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 5x5x0.85 mm | n/a |
| LPC1114FHN33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1114JHN33/203 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1114FHN33/303 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1114JHN33/303 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1114FHN33/333 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1114JHN33/333 | HVQFN33 | HVQFN: plastic thermal enhanced very thin quad flat package; no leads; 33 terminals; body 7x7x0.85 mm | n/a |
| LPC1113FBD48/301 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1113FBD48/302 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1113FBD48/303 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1113JBD48/303 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1114FBD48/301 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1114FBD48/302 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1114FBD48/303 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1114JBD48/303 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1114FBD48/323 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1114JBD48/323 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1114FBD48/333 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1114JBD48/333 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1115FBD48/303 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1115JBD48/303 | LQFP48 | LQFP48: plastic low profile quad flat package; 48 leads; body 7x7x1.4mm ´ | SOT313-2 |
| LPC1115FET48/303 | TFBGA48 | plastic thin fine-pitch ball grid array package; 48 balls; body 4.5x4.5x0.7mm | SOT1155-2 |
| LPC1115JET48/303 | TFBGA48 | plastic thin fine-pitch ball grid array package; 48 balls; body 4.5x4.5x0.7mm | SOT1155-2 |
Application:
it is used for a Wide range of fields :
Industrial products, communication etc
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NXP MCU ARM Flash 32KB Integrated Circuit Parts for Industrial Images
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